Parameter System for Characterization of 3D Morphology of Chip after CMP Processing

Deficiencies of the current characterization of the surface morphology of the chip after chemical mechanical polishing, i.e. the two-dimensional contour features without the whole three-dimensional surface morphology information, and the usage of a single evaluation index to characterize the surface roughness and other issues, a scientific and comprehensive chip surface morphology evaluation parameter system was established and applied to the engineering surface roughness evaluation. By analyzing the amplitude distribution characteristics of chip surface morphology combined with the statistical characteristics of chip surface, a characterization parameter system suitable for chip surface 3D evaluation was established based on ISO 25178-2 standard characterization parameters. The simulation results showed that the amplitude of chip surface topography after CMP processing approximately obeyed Gaussian distribution. Fractal dimension D accurately characterized the surface morphology of the chip and reflected its complexity. The chip surface topography evaluation system established by amplitude parameters, space parameters, mixing parameters and fractal parameters can characterize the three-dimensional surface topography characteristics of the chip from many aspects, and had certain feasibility for the evaluation of chip surface topography parameters.