Molecular Dynamics Simulation of Friction and Wear Behaviors of Au Coating for Conductive Slip Ring

Au and its alloys have been widely used as the coating of satellite-borne conductive slip rings due to their good friction and wear properties. In this paper, the molecular dynamics simulation method was used to study the friction and wear behaviors of Au-Au coatings at elevated temperatures and different friction speeds, and the effect of arc erosion in simulated current friction was simulated by setting the local rapid temperature rise. The results show that the wear of the slip ring and the ring brush was mainly adhesive wear. Temperature increase accelerated the response of the interface force in the pressing process. The wear became more serious and the friction after the running-in period became greater, when the relative movement speed was lower. The main reason for the impact of friction and wear characteristics was the welding center in the vicinity of the center of the temperature rise. The results provided a reference for revealing the micro-mechanism of the friction and wear properties of Au-Au coatings with temperature and velocity, and the molecular dynamics simulation of arc erosion was proposed by local rapid heating.