ISSN   1004-0595

CN  62-1224/O4

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评估TiN薄膜与基材结合的划痕试验及有限元模拟

Scratching Test and Its Finite Element Simulation for Estimating Adhesion between TiN Film and Substrate

  • 摘要: 通过有限元模型模拟划痕试验得到的结果表明∶切应力的起伏变化?膜/基界面处切应力差值?接触区附近膜层表面张应力?高载下的几种应力集中等,对膜/基体系的失效都有重要的作用.通过模型计算临界载荷下的膜/基界面处切应力差值,可用来评价膜层与基材的结合强度;提出了划痕试验中膜/基体系失效的2种机制.不同性能基材的TiN膜/基体系划痕试验结果,可验证本文有限元模拟的有效性,并表明临界载荷是膜/基结合强度?体系承载能力?内聚结合性能等的综合反映;低载往复摩擦磨损试验的结果进一步证实,用划痕试验的临界载荷评估膜/基结合强度具有局限性.

     

    Abstract: The finite element simulation for scratching test showed that undulant variation of shear stress , difference of shear stress at interface of film / substrate , surface tensile stress around contact region , several concentrations under high loading etc . played important roles on failure of film / substrate . The difference of shear stress between film and substrate near interface , which was calculated by the FEM simulation at critical load of scratching test , could be used as a criterion for estimating adhesive strength . Two mechanisms of failure of film / substrate system in scratching test have been suggested . The validity of the FEM simulation has been confirmed by the result of scratching test to TiN film deposited on different substrate . The critical load resulted from synthetic effect of film / substrate system performance , such as adhesion strength , load bearing capacity , cohesion strength . The limitation of estimating adhesive strength of film / substrate by critical load in scratching test further proved by results of friction and wear test in reciprocating sliding under low loading .

     

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