ISSN   1004-0595

CN  62-1224/O4

高级检索

电子制造摩擦学

Electronic Manufacturing Tribology

  • 摘要: 高智能化、高集成度的电子制造是高端制造业的核心上游,其加工的表/界面特征尺寸已逼近原子尺度,制造过程中的摩擦学问题已成为影响加工质量、决定产品性能的关键因素. 文章中提出电子制造摩擦学概念,研究电子器件制造过程中微接触表面间摩擦、磨损、润滑、黏着及其他微观表/界面特性,并探索利用摩擦学制造高性能电子器件的新技术和新方法. 在本文中概述了摩擦学对推动电子制造发展的重要作用,以微机电系统加工、芯片制造、柔性电子制造和高性能存储制造等典型应用领域为例,归纳总结了近20年来国内外在高端电子制造工艺中的摩擦学共性科学问题和研究进展,并评述了其发展方向. 电子制造摩擦学的基础科学问题包括原子精度表面加工中的摩擦学行为及加工原理与方法,高速运动表面纳米润滑理论及表面膜技术以及基于摩擦界面效应的纳尺度加工新原理、新方法. 基于此,未来电子制造摩擦学的发展将与原子制造技术和微纳摩擦学的发展密不可分,重点实现电子制造过程中纳米级、原子级材料的精确去除、迁移和增加,以及应用摩擦学方法开发新型电子制造技术. 电子制造摩擦学相关研究能够丰富微纳米摩擦学内涵,为设计制造高性能、新型电子基础产品提供重要科学依据.

     

    Abstract:
    Electronic manufacturing with high intelligence and high integration features is the upstream of the high-end manufacturing industries. The critical dimension during fabrication process is quite close to the atomic scale, and the tribology phenomenon plays critical role in determining the processing quality and the product performance. The concept of electronic manufacturing tribology was first proposed in the paper. Electronic manufacturing tribology refers to the investigation of tribological problems such as friction, abrasion, lubrication, adhesion and other surface/interface phenomena between micro-contacted surfaces during the manufacturing process of electronic devices, and also the development of new fabrication techniques based on tribology. Its important role in promoting the development of electronic manufacturing was elaborated afterwards in the paper. Tribology in the micro electro mechanical systems (MEMS), the integrated circuit fabrication, the flexible electronic manufacturing and the high-performance storage was taken as typical applications, and their research progress in the last two decades was summarized. Typical electronic fabrication techniques such as the chemical mechanical polishing (CMP), nano-imprint lithography (NIL), friction bonding, self-assembly patterning, surface film techniques and the newly proposed tribotronics were introduced, and the tribological problems such as the friction, abrasion, lubrication and adhesion in them were analyzed comprehensively. The influences of new materials, surroundings and other fabrication working conditions were also taken into account in this paper.
    Based on the above analysis, the scientific fundamentals in the electronic manufacturing tribology was also proposed: the tribological behavior in the atomic fabrication process; the nano-lubrication theory and surface film technology of the high-speed surfaces; the novel nano-fabrication methods and techniques based on tribology theory. Research outlooks were also shown in the paper. The future of electronic manufacturing tribology will be inseparable with the development of micro-nano tribology and the atomic fabrication techniques. Its development will focus on realizing the atomic scale and nano-scale removal, migration and addition of materials, and also the development of new electronic fabrication techniques based on tribology. The relevant research on electronic manufacturing tribology could enrich the micro-nano tribology theory, and provides important basis for developing novel and high-performance basic electronic products as well.

     

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